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Patent Searching and Data


Title:
OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/059557
Kind Code:
A1
Abstract:
The present invention comprises a mounting member (22) which has a diffusion bonding layer (23b) formed on the front surface, an optical semiconductor element (21) which has a light emitting part (21b) and a diffusion bonding layer (23a) which is formed on the rear surface, and an electrode layer (23) formed by diffusion bonding of diffusion bonding layer (23b) and diffusion bonding layer (23a), the light emitting part (21b) being provided more toward the mounting member (22) on the side surface of the optical semiconductor element (21). As a result, the use of solder and Ag paste or the like is not required, preventing contamination of the light emitting part of the optical semiconductor element by solder, and heat dissipation properties are improved by the light emitting part being brought even closer to the mounting member.

Inventors:
NEGISHI MASATO (JP)
Application Number:
PCT/JP2020/009687
Publication Date:
April 01, 2021
Filing Date:
March 06, 2020
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/022; H01L27/144; H01L27/15; H01L33/64; H01S5/024
Foreign References:
JP2011243963A2011-12-01
JP2005123530A2005-05-12
JP2015035532A2015-02-19
JP2013058593A2013-03-28
JP2010192701A2010-09-02
US20170137328A12017-05-18
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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