Title:
OPTICAL SENSOR AND OPTICAL SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/085098
Kind Code:
A1
Abstract:
An optical sensor according to an embodiment of the present disclosure comprises: a light emitting board that has a light emitting element; and a circuit board. The circuit board has: a light transmission part that is provided in a position facing the light emitting element and transmits light from the light emitting element; and one or a plurality of light receiving elements for receiving light reflected by a reflective layer, among the light emitted via the light transmission part. The one or the plurality of light receiving elements are formed, for example, on a first main surface of the circuit board. The light emitting board is disposed, for example, on the circuit board at a position facing a second main surface, which is on the opposing side of the first main surface, and is stacked on the circuit board with a first bump therebetween.
Inventors:
KATSUHARA TOMOKO (JP)
OHTORII HIZU (JP)
TSUKAMOTO KEI (JP)
OHTORII HIZU (JP)
TSUKAMOTO KEI (JP)
Application Number:
PCT/JP2020/038452
Publication Date:
May 06, 2021
Filing Date:
October 12, 2020
Export Citation:
Assignee:
SONY CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01L5/00; G01L5/166
Domestic Patent References:
| WO2014045685A1 | 2014-03-27 |
Foreign References:
| JPS60209128A | 1985-10-21 | |||
| JPS6141938A | 1986-02-28 | |||
| JP2000349306A | 2000-12-15 | |||
| JPH08139367A | 1996-05-31 | |||
| JP2019074421A | 2019-05-16 | |||
| JP2015197357A | 2015-11-09 | |||
| JP2016143561A | 2016-08-08 | |||
| US20140326882A1 | 2014-11-06 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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