Title:
ORIENTED HIGH-THERMAL-CONDUCTIVITY INTERFACE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/184816
Kind Code:
A1
Abstract:
An oriented high-thermal-conductivity interface material and a preparation method therefor. The material is composed of 10-90 parts of a binder resin and 10-90 parts of a long-fiber thermal-conducting material. The preparation method therefor comprises: arranging the long fiber material in a regular manner inside a housing with a preset shape, carrying out curing and forming on the fiber material by means of the binder resin, to obtain a block body, and then according to requirements, cutting the block body to a required thickness to obtain a sheet-shaped oriented high-thermal-conductivity interface material. The high-thermal-conductivity interface material prepared by fiber bundle glue injection has an ultra-high thermal conductivity, and the thermal conductivity coefficient can reach 80 W/(m.k) or even higher; and the high-thermal-conductivity interface material is ultra soft, and can be applied to a 5G communication device which is sensitive to compressive stress and requires heat dissipation.
Inventors:
TANG ZHENGHUA (CN)
Application Number:
PCT/CN2020/131363
Publication Date:
September 23, 2021
Filing Date:
November 25, 2020
Export Citation:
Assignee:
PINGHU ALLIED IND CO LTD (CN)
International Classes:
C08L83/04; C08J5/04; C08K7/06; C09K5/14
Foreign References:
| CN111363358A | 2020-07-03 | |||
| CN103073836A | 2013-05-01 | |||
| JP2001294676A | 2001-10-23 | |||
| CN105199396A | 2015-12-30 | |||
| CN102651961A | 2012-08-29 | |||
| US20150176930A1 | 2015-06-25 |
Attorney, Agent or Firm:
HANGZHOU ZHEKE PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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