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Patent Searching and Data


Title:
OUTPUT ARRAY FOR RF PERFORMANCE IMPROVEMENT
Document Type and Number:
WIPO Patent Application WO/2020/264541
Kind Code:
A3
Abstract:
A power amplifier output stage includes a first output array group (304A) having a first plurality of semiconductor devices, and a first loading adjustment module (308A) coupled to the first output array group (304A). The first loading adjustment module (308A) is configured to adjust a loading of the first output array group (304A) to produce a first power dissipation value. The power amplifier output stage further includes a second output array group (304B) having a second plurality of semiconductor devices, and a second source loading adjustment module (308B) coupled to the second output array group (304B). The second source loading adjustment module (308B) is configured to adjust a source loading of the second output array group (304B) to produce a second power dissipation value, the first power dissipation value being different from the second power dissipation value.

Inventors:
DENG JASON XIANGDONG (US)
JIN YUANYUE (US)
REFAI WAEL YAHIA (US)
GONZALEZ JOSE (US)
KACZMAN DANIEL LEE (US)
ALAM SHAIKH KHAIRUL (US)
Application Number:
PCT/US2020/054256
Publication Date:
March 18, 2021
Filing Date:
October 05, 2020
Export Citation:
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Assignee:
FUTUREWEI TECHNOLOGIES INC (US)
International Classes:
H03F1/30; H03F1/02; H03F3/19; H03F3/21; H03F3/24
Foreign References:
US20180358933A12018-12-13
US20180287561A12018-10-04
US20190006994A12019-01-03
US20020097097A12002-07-25
Attorney, Agent or Firm:
WIEBUSCH, Landon E. (US)
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