Title:
PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2021/251124
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a packaging body comprisingcat least a paper substrate and a hot melt adhesive, wherein the packaging body is characterized in that the hot melt adhesive is obtained by a production method that includes kneading a liquid material for a hot melt adhesive, introducing a liquid comprising water and/or alcohol in a quantity of 0.03 mass parts or more per 100 mass parts of the material for a hot melt adhesive into a heating/kneading machine during said kneading or subsequent thereto, and degassing while heating and stirring or dispersing so that the material for a hot melt adhesive and the liquid come into contact.
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Inventors:
FUJII MAMIKO (JP)
MIYAMARU SATORU (JP)
MIYAMARU SATORU (JP)
Application Number:
PCT/JP2021/019721
Publication Date:
December 16, 2021
Filing Date:
May 25, 2021
Export Citation:
Assignee:
MORESCO CORP (JP)
International Classes:
C09J201/00; B65D75/00; C09J131/04
Domestic Patent References:
| WO2019172434A1 | 2019-09-12 | |||
| WO2019069610A1 | 2019-04-11 | |||
| WO2017057500A1 | 2017-04-06 |
Foreign References:
| JP2009024144A | 2009-02-05 | |||
| JP2006272835A | 2006-10-12 | |||
| US20200248047A1 | 2020-08-06 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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