Title:
PACKAGING METHOD FOR FILTER CHIP, AND PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/114140
Kind Code:
A1
Abstract:
Disclosed are a packaging method for a filter chip (300), and a packaging structure. The packaging method comprises: providing a circuit substrate (100); covering a first surface of the circuit substrate (100) and/or the filter chip (300) with an adhesive material (200), and forming a concave cavity or a closed cavity on the adhesive material (200); adhering the filter chip (300) to the first surface of the circuit substrate (100) by means of the adhesive material (200), and enabling a surface acoustic wave conduction region of the filter chip (300) to correspond to the concave cavity or the closed cavity on the adhesive material (200) to form a gap; an encapsulation material (500) encapsulating the filter chip (300); forming an interconnection hole (104) penetrating from a second surface of the circuit substrate (100) to a pin of the filter chip (300); filling the interconnection hole (104) with a conductive material (600), such that the conductive material (600) makes electric contact with a chip pin bump or bonding pad metal of the filter chip (300); and forming an external pin bonding pad (900) on the second surface. Thus, a cavity may be formed not on the circuit substrate (100), packaging difficulty is reduced, and a lead bonding process or a gold ball flip bonding process is not used, such that the size of a packaging structure of a filter is smaller and thinner.
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Inventors:
YAN YINGQIANG (CN)
HU CHUAN (CN)
CHEN ZHITAO (CN)
HU CHUAN (CN)
CHEN ZHITAO (CN)
Application Number:
PCT/CN2019/124590
Publication Date:
June 17, 2021
Filing Date:
December 11, 2019
Export Citation:
Assignee:
GUANGDONG INST SEMICONDUCTOR INDUSTRIAL TECH (CN)
International Classes:
H03H9/25; H01L23/31
Foreign References:
| CN107786183A | 2018-03-09 | |||
| CN101689846A | 2010-03-31 | |||
| CN106921357A | 2017-07-04 | |||
| CN1499717A | 2004-05-26 | |||
| US20040100164A1 | 2004-05-27 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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