Title:
PAD TEMPERATURE ADJUSTING DEVICE, PAD TEMPERATURE ADJUSTING METHOD, POLISHING DEVICE, AND POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/137802
Kind Code:
A1
Abstract:
The present invention pertains to a pad temperature adjusting device for adjusting the surface temperature of a polishing pad. The pad temperature adjusting device (5) comprises: a pad contacting member (11); a supplying system (30) that supplies a heating liquid and a cooling liquid to the pad contacting member (11); a pad temperature measuring device (39) that measures the surface temperature of a polishing pad (3); and a controlling unit (40) that performs Proportional-Integral-Differential (PID) control on the operation amount of a first flow rate adjusting valve (42) and a second flow rate adjusting valve (56). The controlling unit (40) comprises: a storing unit (110) that stores a learned model constructed for keeping a temperature behavior curve created on the basis of the measured values from the pad temperature measuring device (39) within a designated permissible range; and a processing device (120) that inputs at least one temperature behavior parameter into the learned model and executes calculations to output modification values for the PID parameters for PID control.
Inventors:
MARUYAMA TORU (JP)
Application Number:
PCT/JP2019/049832
Publication Date:
July 02, 2020
Filing Date:
December 19, 2019
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/015; B24B37/12; B24B49/14; G05B13/02; G16Y10/25; G16Y20/10; G16Y40/35; H01L21/304
Foreign References:
| JP2018027582A | 2018-02-22 | |||
| JPH03201008A | 1991-09-02 | |||
| JP2017175264A | 2017-09-28 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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