Title:
PADS FOR CMP AND POLISHING SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2003038862
Kind Code:
A3
Abstract:
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads are substantially porous and substantially hard for improved polishing and planarization properties. Pads according to some embodiments of the present invention have beneficial properties like those of standard technology porous pads and beneficial properties like those of standard technology hard pads.
Inventors:
WEST THOMAS (US)
Application Number:
PCT/US2002/034617
Publication Date:
March 11, 2004
Filing Date:
October 29, 2002
Export Citation:
Assignee:
THOMAS WEST INC (US)
WEST THOMAS (US)
WEST THOMAS (US)
International Classes:
B24B37/24; B24D11/00; B24D13/14; D04H1/42; D04H1/46; D06M15/564; H01L21/304; (IPC1-7): B24D3/32
Foreign References:
| US6095902A | 2000-08-01 | |||
| US4927432A | 1990-05-22 | |||
| US4841680A | 1989-06-27 | |||
| US5197999A | 1993-03-30 | |||
| US5489233A | 1996-02-06 | |||
| US4954141A | 1990-09-04 | |||
| US5212910A | 1993-05-25 |
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