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Title:
PANEL TRANSDUCER SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2021/014222
Kind Code:
A3
Abstract:
A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a fïrst carrier sub strate with a fïrst surface of the acoustic components positioned adjacent to the fïrst carrier substrate. ASIC components are also secured at predetermined locations on the fïrst carrier substrate with a fïrst surface of the ASIC components positioned adjacent to the fïrst carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The fïrst carrier substrate is removed to expose the fïrst surface of the acoustic components and the fïrst surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

Inventors:
BANTIGNIES CLAIRE (FR)
FÉRIN GUILLAUME (FR)
Application Number:
PCT/IB2020/000739
Publication Date:
March 04, 2021
Filing Date:
July 23, 2020
Export Citation:
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Assignee:
VERMON SA (FR)
International Classes:
B06B1/06; G10K11/00
Domestic Patent References:
WO2017143307A12017-08-24
WO2019086496A12019-05-09
Foreign References:
US20120118475A12012-05-17
US20130050226A12013-02-28
Other References:
ZHEYAO WANG: "3-D Integration and Through-Silicon Vias in MEMS and Microsensors", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS., vol. 24, no. 5, 1 October 2015 (2015-10-01), US, pages 1211 - 1244, XP055405155, ISSN: 1057-7157, DOI: 10.1109/JMEMS.2015.2448681
Attorney, Agent or Firm:
CABINET BEAUMONT (FR)
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