Title:
PARTICLE BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/118529
Kind Code:
A1
Abstract:
Provided is a manufacturing method for particle boards with smooth surfaces, the method being capable of reducing dimensional changes due to moisture absorption or desorption and of limiting the occurrence of local swelling when water is absorbed. The particle board (1) is manufactured by passing a mixture of particles, plant fibers (4) having a mean fiber length of 0.3 times to 3.0 times the mean length of the particles, and an adhesive through a mesh that has openings of 0.75 times to 2.0 times the mean length of the particles and then hot compression-molding.
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Inventors:
ASADA TEPPEI
TSUKAMOTO SEISUKE
TSUKAMOTO SEISUKE
Application Number:
PCT/JP2013/050230
Publication Date:
August 15, 2013
Filing Date:
January 09, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
B27N3/06; B27N3/14
Foreign References:
| JP2006116854A | 2006-05-11 | |||
| JPH06297417A | 1994-10-25 |
Attorney, Agent or Firm:
NISHIZAWA TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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Claims: