Title:
PARTICLE BOARD
Document Type and Number:
WIPO Patent Application WO/2013/118531
Kind Code:
A1
Abstract:
Provided is a particle board which has surface smoothness and which has little dimensional variation due to moisture absorption and desorption. A particle board (1) formed by heat-pressure molding a mixture of particles and an adhesive, wherein vegetable fibers (4) are contained in at least a surface layer (2), and the average fiber length of the vegetable fibers (4) in the surface layer (2) is 0.3 to 3.0 times the average length of the particles in the surface layer (2).
Inventors:
TSUKAMOTO SEISUKE
ROKUSHIMA KAZUMASA
SUZUKI SHINICHI
MAEDA NAOHIKO
ASADA TEPPEI
ROKUSHIMA KAZUMASA
SUZUKI SHINICHI
MAEDA NAOHIKO
ASADA TEPPEI
Application Number:
PCT/JP2013/050296
Publication Date:
August 15, 2013
Filing Date:
January 10, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
B27N3/06
Foreign References:
| JP2006116854A | 2006-05-11 | |||
| JPH06297417A | 1994-10-25 |
Attorney, Agent or Firm:
NISHIZAWA TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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Claims: