Title:
PASTE FOR ELECTROMAGNETIC SHIELDING
Document Type and Number:
WIPO Patent Application WO/2021/075265
Kind Code:
A1
Abstract:
The present invention provides a paste for electromagnetic shielding, said paste being easy to fill into gaps and grooves, while being capable of suppressing the occurrence of a void or sink of a resin after filling. A paste for electromagnetic shielding, said paste containing (A) electroconductive particles, (B) a resin having a volatility within the range of from 0.1% by mass to 20% by mass after being held at 130°C for 60 minutes, and (C) a peroxide, while having a viscosity within the range of from 10 mPa∙s to 200,000 mPa∙s at 25°C as determined by a Brookfield viscometer with the number of revolutions of 50 rpm.
Inventors:
HASHIMOTO DAISUKE (JP)
KAPOGLIS YOLANDA IRMA (US)
KAPOGLIS YOLANDA IRMA (US)
Application Number:
PCT/JP2020/037270
Publication Date:
April 22, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H05K9/00
Domestic Patent References:
| WO2017090623A1 | 2017-06-01 | |||
| WO2019082634A1 | 2019-05-02 |
Foreign References:
| JP2017216337A | 2017-12-07 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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