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Patent Searching and Data


Title:
PASTE-LIKE RESIN COMPOSITION, HIGHLY HEAT CONDUCTIVE MATERIAL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/153405
Kind Code:
A1
Abstract:
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that include silver-containing particles or copper-containing particles.

Inventors:
WATABE NAOKI (JP)
ABE YUI (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2021/001980
Publication Date:
August 05, 2021
Filing Date:
January 21, 2021
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08F20/26; C08F299/02; C08G59/40; C08K3/08; C08L33/06; C09J4/02; C09J7/30; C09J11/04; C09J11/06; C09J163/00; H01B1/22; H01L21/52
Domestic Patent References:
WO2019167819A12019-09-06
Foreign References:
JP2017106023A2017-06-15
JP2014074132A2014-04-24
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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