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Patent Searching and Data


Title:
PASTE FOR THROUGH-HOLE FILLING
Document Type and Number:
WIPO Patent Application WO/2019/181463
Kind Code:
A1
Abstract:
Provided is a paste for through-hole filling which is capable of giving a cured object showing excellent adhesion to deposits formed by plating. The paste for through-hole filling comprises (A) a magnetic powder, (B) an epoxy resin, and (C) a hardener, wherein the surface of the magnetic powder (A) has been treated with a surface treatment agent containing at least one element selected from among Si, Al, and Ti.

Inventors:
OOYAMA HIDEKI (JP)
TANAKA TAKAYUKI (JP)
HAYASHI EIICHI (JP)
Application Number:
PCT/JP2019/008435
Publication Date:
September 26, 2019
Filing Date:
March 04, 2019
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
H05K3/42; H01F1/37; H05K1/11; H05K3/18
Foreign References:
JP2016197624A2016-11-24
JP2012227406A2012-11-15
JP2001203463A2001-07-27
JP2003257744A2003-09-12
JP2016100546A2016-05-30
JP2012069878A2012-04-05
JP2016197624A2016-11-24
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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