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Patent Searching and Data


Title:
PATTERN FORMATION MATERIAL, CURED FILM, AND PRODUCTION METHOD FOR CURED PATTERN
Document Type and Number:
WIPO Patent Application WO/2019/221194
Kind Code:
A1
Abstract:
A pattern formation material containing: an acid group-containing resin having a polymerizable double bond; and a lithium partially-fixed smectite.

Inventors:
YAMADA SHUNSUKE (JP)
KANO YUUSUKE (JP)
SAKURAI HIROKO (JP)
NAKASHIMA MICHIYA (JP)
Application Number:
PCT/JP2019/019364
Publication Date:
November 21, 2019
Filing Date:
May 15, 2019
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
G03F7/004; C08F299/02; C08L33/02; C08L35/00; G03F7/027; G03F7/20; H05K3/28
Domestic Patent References:
WO2018168945A12018-09-20
WO2018168947A12018-09-20
Foreign References:
JP2017198977A2017-11-02
JP2011183812A2011-09-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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