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Patent Searching and Data


Title:
PATTERN FORMATION METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/172111
Kind Code:
A1
Abstract:
The present invention provides a pattern formation method having (i) a step for forming an actinic ray-sensitive or radiation-sensitive film 700 nm or more thick by a specific actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step for irradiating the actinic ray-sensitive or radiation-sensitive film with actinic rays or radiation of a wavelength of 200 nm or less, and (iii) a step for developing the actinic ray-sensitive or radiation-sensitive film that has been irradiated with actinic rays or radiation of a wavelength of 200 nm or less by a developer; a method for producing an electronic device; and an actinic ray-sensitive or radiation-sensitive resin composition.

Inventors:
YOSHINO FUMIHIRO (JP)
KURUMISAWA YUMA (JP)
Application Number:
PCT/JP2021/005775
Publication Date:
September 02, 2021
Filing Date:
February 16, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/06; C07C309/12; C07C309/17; C07C317/04; C07C381/12; C08F12/22; C08F20/26; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2019167481A12019-09-06
WO2019064961A12019-04-04
Foreign References:
JPH0973173A1997-03-18
JP2019139233A2019-08-22
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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