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Patent Searching and Data


Title:
PATTERNED SUBSTRATE, EPITAXIAL WAFER, MANUFACTURING METHOD, STORAGE MEDIUM AND LED CHIP
Document Type and Number:
WIPO Patent Application WO/2020/237767
Kind Code:
A1
Abstract:
The present invention relates to a patterned substrate, an epitaxial wafer, a manufacturing method, a storage medium and an LED chip. The patterned substrate is applied to a Micro LED, because the body of the patterned substrate is provided with at least one accommodating groove capable of accommodating at least some epitaxial material dropped during an epitaxial process. According to the patterned substrate provided in the present invention, at least some excess epitaxial material produced during a high-speed rotational molding process of an epitaxial layer in an MOCVD furnace can be dropped into an accommodating groove and not remain on the epitaxial layer, thereby ameliorating the problem of the thickness of the epitaxial layer being uneven, and thus improving wavelength uniformity, that is, the patterned substrate provided in the present invention at least ameliorates the problem of wavelength non-uniformity.

Inventors:
LIN WEIHAN (CN)
YANG MEIHUI (CN)
Application Number:
PCT/CN2019/093260
Publication Date:
December 03, 2020
Filing Date:
June 27, 2019
Export Citation:
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Assignee:
KONKA GROUP CO LTD (CN)
International Classes:
H01L33/20
Foreign References:
CN102856451A2013-01-02
CN105047537A2015-11-11
CN101820041A2010-09-01
CN101740677A2010-06-16
CN108598236A2018-09-28
Attorney, Agent or Firm:
JOHNSON INTELLECTUAL PROPERTY AGENCY (SHENZHEN) (CN)
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