Title:
PCB HEAT DISSIPATION ASSEMBLY AND SERVER HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2021/081927
Kind Code:
A1
Abstract:
A PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) comprises: a PCB board (1), multiple chips (11) being provided on the PCB board (1); at least one heat dissipation device (2), the heat dissipation device (2) being disposed on the multiple chips (11), and the heat dissipation device (2) comprising a heat dissipation air channel (21); an air baffle (3), the air baffle (3) being disposed adjacent to the at least one heat dissipation device (2), the air baffle (3) being located on one side of the at least one heat dissipation device (2), and the air baffle (3) extending along the heat dissipation air channel (21).
Inventors:
ZHOU XUESONG (CN)
PAN JIANJUN (CN)
LIAO SHIZHEN (CN)
ZHANG SHUHAO (CN)
WANG XUDONG (CN)
PAN JIANJUN (CN)
LIAO SHIZHEN (CN)
ZHANG SHUHAO (CN)
WANG XUDONG (CN)
Application Number:
PCT/CN2019/114832
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H05K7/20
Foreign References:
| CN102573398A | 2012-07-11 | |||
| CN208848155U | 2019-05-10 | |||
| US8776833B2 | 2014-07-15 | |||
| CN2904598Y | 2007-05-23 | |||
| CN103901977A | 2014-07-02 | |||
| CN103165548A | 2013-06-19 | |||
| CN110134207A | 2019-08-16 | |||
| CN201750358U | 2011-02-16 |
Other References:
See also references of EP 4007467A4
Attorney, Agent or Firm:
JW & PARTNERS (CN)
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