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Patent Searching and Data


Title:
PERMANENT RESIST COMPOSITION, CURED PRODUCT THEREOF, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO2005079330
Kind Code:
A3
Abstract:
A permanent photoresist composition comprising: (A) one or more bisphenol A-novolac epoxy resins according to Formula I; wherein each group R in Formula I is individually selected from glycidyl or hydrogen and k in Formula I is a real number ranging from 0 to about 30; (B) one or more epoxy resins selected from the group represented by Formulas BIIa and BIIb; wherein each R1, R2 and R3 in Formula BIIa are independently selected from the group consisting of hydrogen or alkyl groups having 1 to 4 carbon atoms and the value of p in Formula BIIa is a real number ranging from 1 to 30; the values of n and m in Formula BIIb are independently real numbers ranging from 1 to 30 and each R4 and R5 in Formula BIIb are independently selected from hydrogen, alkyl groups having 1 to 4 carbon atoms, or trifluoromethyl; (C) one or more cationic photoinitiators (also known as photoacid generators or PAGs); and (D) one or more solvents.

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Inventors:
WEBER WILLIAM (US)
MORI SATOSHI (JP)
HONDA NAO (JP)
JOHNSON DONALD (US)
DOCANTO MANUEL (US)
Application Number:
PCT/US2005/004504
Publication Date:
November 30, 2006
Filing Date:
February 10, 2005
Export Citation:
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Assignee:
MICROCHEM CORP (US)
NIPPON KAYAKU KK (JP)
International Classes:
G03F7/038; C08G59/32; C08G59/68; G03C1/492; G03F7/00
Foreign References:
US5218061A1993-06-08
US5726216A1998-03-10
JPH09169834A1997-06-30
US6541541B22003-04-01
US4296018A1981-10-20
US4882245A1989-11-21
US4940651A1990-07-10
US5026624A1991-06-25
Other References:
PATENT ABSTRACTS OF JAPAN
"Improved Compositions for a Dry Film Soldermask", IBM TECHNICAL DISCLOSURE BULLETIN, December 1990 (1990-12-01), XP000108405
See also references of EP 1730592A4
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