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Title:
PHENOL RESIN FOAM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2021/157698
Kind Code:
A1
Abstract:
A phenol resin foam laminate in which a flexible surface material is arranged on at least the upper and lower surfaces of a phenol resin foam, wherein the phenol resin foam includes HCFO-1224yd (Z) and has a density of 20 kg/m3 to 55 kg/m3 (inclusive), a closed cell ratio 80% or more, an average cell diameter of 60-200 µm (inclusive), an exudation area ratio from the surface material of 30% or less, and a content of HCFO-1224yd (Z) of 0.06-0.35 mol (inclusive) per 22.4 × 10-3 m3 in the space volume in the phenol resin foam.

Inventors:
MIHORI HISASHI (JP)
MIYATA NARUMI (JP)
HIRAMATSU NOBUKI (JP)
Application Number:
PCT/JP2021/004337
Publication Date:
August 12, 2021
Filing Date:
February 05, 2021
Export Citation:
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Assignee:
ASAHI KASEI CONSTR MAT CORP (JP)
International Classes:
B32B5/24; B32B5/18; B32B27/12; B32B27/42; C08G8/10; C08J9/14
Domestic Patent References:
WO2021002097A12021-01-07
WO2019036049A12019-02-21
WO2016152155A12016-09-29
Foreign References:
JP2014504675A2014-02-24
JP2014530939A2014-11-20
JP2018095869A2018-06-21
JP2019072922A2019-05-16
JP2015105343A2015-06-08
JP2021038313A2021-03-11
JP2008024868A2008-02-07
JPH10225993A1998-08-25
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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