Title:
PHENOLIC RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2021/039558
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a phenolic resin which has excellent flowability and gives cured objects having an excellent balance among high-temperature modulus, low hygroscopicity, and dielectric properties and which is suitable for use in semiconductor-encapsulating materials, etc.; a composition; and a cured object obtained from the composition. The phenolic resin is characterized by being a product of reaction between a monophenol compound and a hydroxylated aromatic carboxylic acid and in that in GPC analysis, the total area of peaks assignable to an ester compound represented by formula (1) and a ketone compound (2) represented by formula (2) accounts for 70-99%. (In the formulae, R1 to R17 are each independently a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms.)
Inventors:
HIROTA YOUSUKE (JP)
Application Number:
PCT/JP2020/031384
Publication Date:
March 04, 2021
Filing Date:
August 20, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C07C45/46; C07C49/83; C07C67/08; C07C69/86; C08G59/62; C08J5/24; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
| WO2018003513A1 | 2018-01-04 |
Foreign References:
| JPS56120642A | 1981-09-22 | |||
| JPS4739048A | ||||
| JP2012519172A | 2012-08-23 | |||
| JPS57154140A | 1982-09-22 | |||
| JP2018100319A | 2018-06-28 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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