Title:
PHENOLIC RESIN, EPOXY RESIN COMPOSITION CONTAINING PHENOLIC RESIN, AND CURED PRODUCT OF SAID EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/175346
Kind Code:
A1
Abstract:
Provided are: a phenolic resin that is capable of providing an epoxy resin composition, a cured product of which has excellent heat resistance and flame retardancy; and an epoxy resin composition or the like, which contains this phenolic resin.
This phenolic resin is represented by general formula (1) or the like.
(In the formula, P represents a structural formula (a); R2 represents a hydrogen atom, an alkyl group having 1-6 carbon atoms, a phenyl group or an alkoxy group having 1-6 carbon atoms; X represents a methylene group or an oxygen atom; and n represents an average satisfying 0 < n ≤ 5.)
Inventors:
KIMURA MASAMITSU (JP)
NAKANISHI MASATAKA (JP)
NAKANISHI MASATAKA (JP)
Application Number:
PCT/JP2014/061462
Publication Date:
October 30, 2014
Filing Date:
April 23, 2014
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G12/40; C07D209/46; C08G59/62
Foreign References:
| RU2474591C1 | 2013-02-10 | |||
| GB1158606A | 1969-07-16 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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