Title:
PHOSPHORUS-CONTAINING PHENOXY RESIN, RESIN COMPOSITION, CURED PRODUCT, LAMINATED PLATE FOR ELECTRIC/ELECTRONIC CIRCUITS, AND METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2021/193273
Kind Code:
A1
Abstract:
Provided are a phosphorus-containing phenoxy resin having excellent fire-resistance and solubility, a resin composition containing said phosphorus-containing phenoxy resin and a curing agent, a cured product thereof having excellent heat resistance and strength, and a laminated plate for electric/electronic circuits. This phosphorus-containing phenoxy resin is represented by formula (1), and has a weight average molecular weight of 10,000-200,000 and a percentage content of phosphorus of 1-6 mass%. In the formula, X represents a divalent group represented by formula (2), and Y represents a hydrogen atom, an acyl group, or a glycidyl group. Z represents an acyl group or a hydrogen atom, and the acyl group accounts for 5 mol% or more of all of said Z. "A" represents a benzene ring, a naphthalene ring, an anthracene ring, or a phenanthrene ring. W represents a phosphorus-containing group represented by formula (3).
Inventors:
AKIBA KEITA (JP)
SATO HIROSHI (JP)
SATO HIROSHI (JP)
Application Number:
PCT/JP2021/010755
Publication Date:
September 30, 2021
Filing Date:
March 17, 2021
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G59/06; C08G59/62
Domestic Patent References:
| WO2019065552A1 | 2019-04-04 |
Foreign References:
| JP2019147863A | 2019-09-05 | |||
| JP2007177054A | 2007-07-12 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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