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Title:
PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE LAYER, AND PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2011/068117
Kind Code:
A1
Abstract:
Provided is a photocurable pressure-sensitive adhesive composition which does not cause squeeze-out under ordinary temperature and pressure conditions and exhibits sufficient initial tack via drying and crosslinking and which is easily curable by light irradiation and can form a curable pressure-sensitive adhesive layer having high peel resistance. Also provided are a photocurable pressure-sensitive adhesive layer and a photocurable pressure-sensitive adhesive sheet. A photocurable pressure-sensitive adhesive composition which comprises both a graft polymer obtained by grafting a chain that contains a monomer bearing a cyclic ether group onto a (meth)acrylic polymer that contains 0.2 to 10wt% of hydroxyalkyl(meth)acrylamide monomer units, and a cationic photopolymerization initiator; a photocurable pressure-sensitive adhesive layer using the same; and a photocurable pressure-sensitive adhesive sheet.

Inventors:
FUJITA SHIGERU (JP)
MOROISHI YUTAKA (JP)
NAKANO FUMIKO (JP)
INOUE TETSUO (JP)
Application Number:
PCT/JP2010/071475
Publication Date:
June 09, 2011
Filing Date:
December 01, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
FUJITA SHIGERU (JP)
MOROISHI YUTAKA (JP)
NAKANO FUMIKO (JP)
INOUE TETSUO (JP)
International Classes:
C09J151/00; C08F265/06; C09J7/38; C09J11/06
Foreign References:
JPH11116903A1999-04-27
JPH0641506A1994-02-15
JPH1143660A1999-02-16
JP2006104328A2006-04-20
JPS63260978A1988-10-27
JP2003147311A2003-05-21
JP2008174667A2008-07-31
JPH10140095A1998-05-26
Other References:
"Polymer Handbook", JOHN WILEY & SONS. INC.
"Organic Peroxide Catalog", May 2003, NOF CORPORATION
See also references of EP 2508583A4
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
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