PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD

Title:

PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2018/062179

Kind Code:

A1

Abstract:

Provided are: a photocurable resin composition capable of forming a cured product that has superior printing properties, i.e., free of oozing, streaks, etc., and superior crack resistance; a dry film having a resin layer obtained using the composition; a cured product obtained by curing the composition or the resin layer of the dry film; and a printed circuit board comprising the cured product. The photocurable resin composition contains (A) an epoxy (meth)acrylate having a urethane bond and a bisphenol AD skeleton, (B) a photopolymerization initiator, and (C) a filler.

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Inventors:

MAKITA SHOHEI (JP)
MINEGISHI SHOJI (JP)
NITA YUTAKA (JP)

Application Number:

PCT/JP2017/034741

Publication Date:

April 05, 2018

Filing Date:

September 26, 2017

Export Citation:

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Assignee:

TAIYO INK MFG CO LTD (JP)

International Classes:

C08F299/06; C08F290/06; C08G59/14; C08L63/10; G03F7/004; G03F7/027; H05K3/28

Domestic Patent References:

WO2015111136A1

2015-07-30

Foreign References:

JPH11116890A	1999-04-27
JP2009186564A	2009-08-20
JP2016011409A	2016-01-21
JP2006323039A	2006-11-30
JP2016081064A	2016-05-16

Attorney, Agent or Firm:

HONDA Ichiro (JP)

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