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Title:
PHOTOCURABLE RESIN COMPOSITION, RESIN LAYER OF SAME, AND MOLD FOR IMPRINT
Document Type and Number:
WIPO Patent Application WO/2017/199893
Kind Code:
A1
Abstract:
Provided is a photocurable resin composition which forms a resin layer having solvent resistance, and which enables easy formation of a releasing layer on the resin layer. The present invention provides a photocurable resin composition which contains a (meth)acrylate compound and a silicone oligomer having an alkoxy group that is bonded with a silicon atom.

Inventors:
MIYAZAWA YUKIHIRO (JP)
TAKEDA AI (JP)
Application Number:
PCT/JP2017/018137
Publication Date:
November 23, 2017
Filing Date:
May 15, 2017
Export Citation:
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Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
H01L21/027; B29C33/38; B29C59/04; C08F2/44; C08F220/18; C08F290/06
Foreign References:
JP2015152726A2015-08-24
JP2013168522A2013-08-29
JP2016057356A2016-04-21
JP2013163354A2013-08-22
JP2015157411A2015-09-03
JP2016035046A2016-03-17
Other References:
See also references of EP 3460828A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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