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Title:
PHOTOCURABLE RESIN COMPOSITION FOR NAILS OR ARTIFICIAL NAILS, CURED PRODUCT, AND METHOD FOR COATING NAILS OR ARTIFICIAL NAILS
Document Type and Number:
WIPO Patent Application WO/2022/163248
Kind Code:
A1
Abstract:
Provided is a photocurable resin composition for nails or artificial nails, the composition having low curing heat. The present invention provides a photocurable resin composition for nails or artificial nails, the composition containing components (A) to (D), indicated below, wherein the molecular weight of the component (C) is equal to or greater than 200: the component (A) is a urethane (meth)acrylate oligomer; the component (B) is a monomer selected from the group consisting of a (meth)acrylate monomer, a (meth)acrylamide monomer, and a (meth)acrylic acid (excluding the component (A)); the component (C) is a compound having a polyglycerin that does not have a (meth)acryloyl group and/or a polyglyceryl ether skeleton that does not have a (meth)acryloyl group; and the component (D) is a photoinitiator.

Inventors:
MORIKAWA YUMI (JP)
Application Number:
PCT/JP2021/048019
Publication Date:
August 04, 2022
Filing Date:
December 23, 2021
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
A45D29/18; A45D31/00; A61K8/81; A61K8/87; A61Q3/02; C08F290/06
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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