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Patent Searching and Data


Title:
PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL SHAPING
Document Type and Number:
WIPO Patent Application WO/2021/205954
Kind Code:
A1
Abstract:
Provided is a photocurable resin composition which is suitable for use in three-dimensional shaping and is capable of forming excellent shaped objects that are usable as molds for resin injection molding and have all of heat resistance, high bending modulus, and high bending strength. The photocurable resin composition for three-dimensional shaping comprises (A) a resin component comprising a (meth)acrylate compound (A1) represented by general formula (1) [R1 is a hydrogen atom or a methyl group and R2 is a linear, branched, or cyclic trivalent hydrocarbon group having 1-8 carbon atoms and optionally having three or less heteroatoms] and a urethane (meth)acrylate (A2) having two or more radical-polymerizable functional groups, (B) inorganic particles, and (C) a free-radical photopolymerization initiator, wherein the (meth)acrylate compound (A1) is contained in an amount of 40-90 mass% with respect to the resin component (A) and the urethane (meth)acrylate compound (A2) is contained in an amount of 10-60 mass% with respect to the resin component (A).

Inventors:
OGAWA Ryo (JP)
Application Number:
PCT/JP2021/013801
Publication Date:
October 14, 2021
Filing Date:
March 31, 2021
Export Citation:
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Assignee:
CANON KABUSHIKI KAISHA (JP)
International Classes:
C08F290/06; B33Y10/00; B29C64/135; C08K3/013; B33Y70/00
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
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