Title:
PHOTOCURABLE SHEET ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2021/200758
Kind Code:
A1
Abstract:
Provided is a photocurable sheet adhesive that contains an (A) component, a (B) component, and a (C) component, wherein at least one epoxy resin constituting the (B) component gives a cured product that has a glass transition temperature (Tg) of 25°C or lower. The photocurable sheet adhesive can be sufficiently cured by only irradiation with light. (A) component: A binder resin component composed of one or more binder resins.
(B) component: An epoxy-based curable component composed of one or more epoxy resins.
(C) component: A photocationic polymerization initiator.
Inventors:
HASEGAWA TATSUKI (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2021/013142
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08G59/32; C08G59/40; C08L63/00; C09J7/35; C09J163/00; C09J171/10; C09J201/00
Domestic Patent References:
| WO2018047919A1 | 2018-03-15 | |||
| WO2010140442A1 | 2010-12-09 |
Foreign References:
| JP2015504580A | 2015-02-12 | |||
| JP2011225773A | 2011-11-10 | |||
| JP2017504664A | 2017-02-09 | |||
| JP2010230944A | 2010-10-14 | |||
| JP2012082266A | 2012-04-26 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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