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Patent Searching and Data


Title:
PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN
Document Type and Number:
WIPO Patent Application WO/2017/131047
Kind Code:
A1
Abstract:
The presentt invention addresses the problem of providing a photocuring method that obtains a crosslinked product (resin) quickly and efficiently, a compound used in the photocuring method, and a photocurable resin composition containing the compound. The present invention pertains to a photocuring method that carries out a step 2 after a step 1, a compound used in the photocuring method, and a photocurable resin composition containing the compound. Step 1: A step that reacts (B) a silane coupling agent having a mercapto group or a (meth)acryl group and (C) water under acidic conditions in the presence of (A) a compound having a carbonyl group that generates radicals and a carboxyl group that decarboxylates due to light irradiation, and obtains a silane compound having a mercapto group or (meth)acryl group and at least one silanol group. Step 2: A step that forms a crosslinked product including structural units derived from the silane compound (D) from the silane compound (D) and, if necessary, (F) a compound having two or more polymerizable unsaturated groups in the presence of compound (A) and (E) a compound having a carbonyl group that generates radicals and a group that generates a base by decarboxylation upon light irradiation, by rendering the interior of the reaction system alkaline by generating a base from compound (E) together with decarboxylating the carboxyl group of compound (A) by irradiating light onto compound (A) and compound (E) and generating radicals from compound (A) and compound (E).

Inventors:
SAKAI NOBUHIKO (JP)
YANABA KOSUKE (JP)
IMAZEKI SHIGEAKI (JP)
ARIMITSU KOJI (JP)
Application Number:
PCT/JP2017/002588
Publication Date:
August 03, 2017
Filing Date:
January 25, 2017
Export Citation:
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Assignee:
WAKO PURE CHEM IND LTD (JP)
UNIV TOKYO SCIENCE FOUND (JP)
International Classes:
C08G75/045; C07C59/84; C07D311/86; C07D335/16; C08F2/50; C08F299/08; G03F7/004
Domestic Patent References:
WO2014208632A12014-12-31
WO2015076395A12015-05-28
Foreign References:
JPS5649337A1981-05-02
US5281620A1994-01-25
JP2010084144A2010-04-15
JP2007291313A2007-11-08
JPS63278936A1988-11-16
Other References:
See also references of EP 3409709A4
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