Title:
PHOTOELECTRIC SENSOR SUBSTRATE MODULE AND PHOTOELECTRIC SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/184104
Kind Code:
A1
Abstract:
This photoelectric sensor substrate module includes: a mounting substrate including a substrate and an operation display unit and a light projecting/receiving element which are mounted on the substrate; and a cover member that covers a part of the mounting substrate, wherein the cover member is formed so as to cover the operation display unit and expose the light projecting/receiving element from the cover member, and the cover member is formed from a crystalline thermoplastic hot-melt resin having a degree of crystallization of 8%-22% as measured by means of X-ray diffraction.
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Inventors:
NISHIKAWA KAZUYOSHI (JP)
MIYATA TSUYOSHI (JP)
MIZUSAKI HIROYUKI (JP)
SAWADA YASUYOSHI (JP)
TANI YOSHIKI (JP)
MIYATA TSUYOSHI (JP)
MIZUSAKI HIROYUKI (JP)
SAWADA YASUYOSHI (JP)
TANI YOSHIKI (JP)
Application Number:
PCT/JP2020/006477
Publication Date:
September 17, 2020
Filing Date:
February 19, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H35/00
Foreign References:
| JP2014032805A | 2014-02-20 | |||
| JP2009079088A | 2009-04-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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