PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION

Title:

PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2005/035602

Kind Code:

A1

Abstract:

A photoresist resin comprising at least repeating unit (A) having a group which is partly detached by an acid to thereby become soluble in alkali and repeating unit (B) containing an alicyclic skeleton having a polar group, characterized in that the weight average molecular weight thereof is in the range of 3000 to 15,000 and that the content of polymers whose molecular weight exceeds 40,000 is 4 wt.% or less. The molecular weight distribution (Mw/Mn) of the resin is in the range of, for example, about 1.1 to 3.0, preferably 1.5 to 2.5.

Inventors:

KAMBARA SHIGEKI (JP)
KISHIMURA MASAAKI (JP)

Application Number:

PCT/JP2004/008845

Publication Date:

April 21, 2005

Filing Date:

June 17, 2004

Export Citation:

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Assignee:

DAICEL CHEM (JP)
KAMBARA SHIGEKI (JP)
KISHIMURA MASAAKI (JP)

International Classes:

C08F22/20; C08F220/10; C08F220/18; C08F220/20; C08F220/28; G03F7/033; C08L33/14; G03C1/492; G03F7/039; (IPC1-7): C08F220/10; C08F22/20; C08F220/28; C08L33/14; G03F7/039

Foreign References:

JP2003084436A	2003-03-19
JP2001278919A	2001-10-10
JP2003221403A	2003-08-05
JP2000026446A	2000-01-25
JPH0973137A	1997-03-18
JP2002311590A	2002-10-23

Other References: