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Patent Searching and Data


Title:
PHOTOSENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/043342
Kind Code:
A1
Abstract:
[Problem] To provide a novel photosensitive adhesive composition. [Solution] A photosensitive adhesive composition which comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the component (A). Component (A) is a polymer which has a structural unit represented by formula (1) and has, at a terminal, a structure represented by formula (2); component (B) is a polymer which has a structural unit represented by the formula (1) and has the carboxy or hydroxy group at a terminal; component (C) is a free-radical photopolymerization initiator; and component (D) is a solvent. (In the formulae, X represents a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group; m and n are each independently 0 or 1; Q represents a C1-16 divalent hydrocarbon group; Z represents a C1-4 divalent linking group, the divalent linking group being bonded to the -O- moiety of the formula (1); and R1 represents a hydrogen atom or a methyl group.)

Inventors:
OHASHI TAKUYA (JP)
ENOMOTO TOMOYUKI (JP)
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2017/030568
Publication Date:
March 08, 2018
Filing Date:
August 25, 2017
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C09J167/00; C08F290/06; C08F299/02; C08G75/045; C09J11/06; C09J167/07; C09J171/08; G03F7/004; G03F7/027
Domestic Patent References:
WO2012169580A12012-12-13
WO2013035787A12013-03-14
Foreign References:
JP2008143954A2008-06-26
Other References:
See also references of EP 3502206A4
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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