Title:
PHOTOSENSITIVE INSULATING FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/187481
Kind Code:
A1
Abstract:
Provided are: a photosensitive insulating film composition that gives a cured body for which the initial dielectric tangent is low and changes over time therein are small; a method for producing a cured relief pattern-equipped substrate using the photosensitive insulating film composition; and a semiconductor device provided with the cured relief pattern. A photosensitive insulating film-forming composition containing a polymer having a repeating unit structure represented by formula (1): [in formula (1), group A1 represents an aromatic heterocycle represented by (A1); group A2 represents an aromatic heterocycle represented by (A2); group A1 and group A2 may have crosslinkable substituents; group B1 represents an organic group having a crosslinkable substituent; and group B2 represents an organic group not having a crosslinkable substituent.] and a solvent.
Inventors:
ENDO MASAHISA (JP)
SAWADA KAZUHIRO (JP)
KISHIOKA TAKAHIRO (JP)
SAWADA KAZUHIRO (JP)
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2021/010607
Publication Date:
September 23, 2021
Filing Date:
March 16, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G67/00; G03F7/027; G03F7/038; G03F7/20
Domestic Patent References:
| WO2019044874A1 | 2019-03-07 | |||
| WO2020021827A1 | 2020-01-30 |
Foreign References:
| JP2015168775A | 2015-09-28 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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