Title:
PHOTOSENSITIVE LAMINATE, METHOD FOR MANUFACTURING PHOTOSENSITIVE LAMINATE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/137444
Kind Code:
A1
Abstract:
The present invention relates to: a photosensitive laminate comprising a support substrate and a photosensitive resin layer formed on the support substrate, wherein the number of bubbles having a diameter of less than 1 μm present in the photosensitive resin layer is at most 5/mm2; and a method for manufacturing the photosensitive laminate.
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Inventors:
SUK SANG HOON (KR)
Application Number:
PCT/KR2020/017155
Publication Date:
July 08, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
G03F7/004; C08F220/30; C08F265/06; G03F7/027; G03F7/033; G03F7/20; G03F7/26; H05K3/06
Foreign References:
| JP2006106287A | 2006-04-20 | |||
| JP2007128015A | 2007-05-24 | |||
| KR20180077724A | 2018-07-09 | |||
| JP2006030999A | 2006-02-02 | |||
| JP2012255925A | 2012-12-27 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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