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Patent Searching and Data


Title:
PHOTOSENSITIVE PHOTORESIST RESIN MONOMER CONTAINING POLYCYCLIC β-KETONE STRUCTURE, AND METHOD FOR SYNTHESIZING SAME
Document Type and Number:
WIPO Patent Application WO/2021/253478
Kind Code:
A1
Abstract:
Disclosed is a photosensitive photoresist resin monomer containing a polycyclic β-ketone structure, which relates to the field of photoresist resin monomers. Structural formula (I) thereof is shown as follows: R1 is methyl or H, R2 and R3 are independently hydrogen, an alkyl and a cycloalkyl respectively, R4 is an alkyl or cycloalkyl, and R2 and R4, R3 and R4, or R2 and R3 can form a ring structure by means of covalent bond linkage; and n is an integer from 1 to 10. The resin monomer has a large solubility difference before and after exposure, can reduce roughness and improve sensitivity and resolution, is conducive to forming a photoetched pattern with good uniformity, and has a good etching resistance.

Inventors:
FU ZHIWEI (CN)
HE BAOYUAN (CN)
SHAO YANLIANG (CN)
PAN XINGANG (CN)
XUE FUKUI (CN)
Application Number:
PCT/CN2020/098451
Publication Date:
December 23, 2021
Filing Date:
June 28, 2020
Export Citation:
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Assignee:
XUZHOU B&C CHEMICAL CO LTD (CN)
International Classes:
C07C69/54; C07C67/29; C07D309/12; G03F7/004; G03F7/027
Foreign References:
CN111138288A2020-05-12
US20020143130A12002-10-03
CN1931858A2007-03-21
Attorney, Agent or Firm:
BEIJING ZHUANYING PATENT AGENCY CO., LTD. (CN)
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