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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/149542
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C). (In the formula, R51 is a C1–9 saturated hydrocarbyl group. R52 is a C10–25 saturated hydrocarbyl group. n1 and n2 are numbers that fulfil 0 ≤ n1 < 1, 0 < n2 ≤ 1, and n1 + n2 = 1. m11 represents an integer from 0 to 3 and m2 represents an integer from 1 to 3.)

Inventors:
MARUYAMA HITOSHI (JP)
Application Number:
PCT/JP2021/000738
Publication Date:
July 29, 2021
Filing Date:
January 13, 2021
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G59/62; C08G77/50; G03F7/004; G03F7/038; G03F7/075; G03F7/20; G03F7/40
Domestic Patent References:
WO2010119647A12010-10-21
Foreign References:
JPH04253059A1992-09-08
JP2007122029A2007-05-17
JP2001022055A2001-01-26
JPS5984238A1984-05-15
JP2002088158A2002-03-27
JP2008184571A2008-08-14
US3220972A1965-11-30
US3159601A1964-12-01
US3159662A1964-12-01
US3775452A1973-11-27
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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