Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/149542
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C). (In the formula, R51 is a C1–9 saturated hydrocarbyl group. R52 is a C10–25 saturated hydrocarbyl group. n1 and n2 are numbers that fulfil 0 ≤ n1 < 1, 0 < n2 ≤ 1, and n1 + n2 = 1. m11 represents an integer from 0 to 3 and ｍ2 represents an integer from 1 to 3.)
Inventors:
MARUYAMA HITOSHI (JP)
Application Number:
PCT/JP2021/000738
Publication Date:
July 29, 2021
Filing Date:
January 13, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G59/62; C08G77/50; G03F7/004; G03F7/038; G03F7/075; G03F7/20; G03F7/40
Domestic Patent References:
| WO2010119647A1 | 2010-10-21 |
Foreign References:
| JPH04253059A | 1992-09-08 | |||
| JP2007122029A | 2007-05-17 | |||
| JP2001022055A | 2001-01-26 | |||
| JPS5984238A | 1984-05-15 | |||
| JP2002088158A | 2002-03-27 | |||
| JP2008184571A | 2008-08-14 | |||
| US3220972A | 1965-11-30 | |||
| US3159601A | 1964-12-01 | |||
| US3159662A | 1964-12-01 | |||
| US3775452A | 1973-11-27 |
Other References:
See also references of EP 4095178A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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