Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND CURED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2007/015375
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof. [MEANS FOR SOLVING PROBLEMS] An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a’) represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. (1) [In the formula, n represents a positive number of 1 to 10 as an average value.]

Inventors:
TANAKA RYUTARO (JP)
KURIHASHI TORU (JP)
KOYANAGI HIROO (JP)
Application Number:
PCT/JP2006/314360
Publication Date:
February 08, 2007
Filing Date:
July 20, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON KAYAKU KK (JP)
TANAKA RYUTARO (JP)
KURIHASHI TORU (JP)
KOYANAGI HIROO (JP)
International Classes:
C08F299/02; G03F7/027; C08G59/20; G03F7/004
Foreign References:
JP2004155916A2004-06-03
JPH11140144A1999-05-25
Attorney, Agent or Firm:
KAWAGUCHI, Yoshio et al. (Yuhsen Shinjuku Gyoen Bldg. 1-11, Shinjuku 1-chome, Shinjuku-k, Tokyo 22, JP)
Download PDF: