Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/054226
Kind Code:
A1
Abstract:
A thermal base generator is represented by formula (N1). This photosensitive resin composition contains the thermal base generator and a precursor of a heterocycle-containing polymer. In formula (N1), RN1 and RN2 each independently represent a monovalent organic group, RC1 represents a hydrogen atom or a protecting group, and L represents a divalent linking group. This cured film is formed by curing the photosensitive resin composition. This laminate has two or more cured films, and has a metal layer between the cured films. This method for producing a cured film comprises a film-forming step for applying the photosensitive resin composition onto a substrate to form a film. This semiconductor device has the cured film or the laminate.
Inventors:
IWAI YU (JP)
YOSHIDA KENTA (JP)
YOSHIDA KENTA (JP)
Application Number:
PCT/JP2019/029188
Publication Date:
March 19, 2020
Filing Date:
July 25, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/00; C08F290/14; G03F7/004; G03F7/027; G03F7/037; C07C233/05; C07C233/06; C07C233/07; C07C233/09; C07C233/58; C07C233/65; C07C235/14; C07D207/12; C07D211/16; C07D295/185; C07D307/20; C07D309/12
Domestic Patent References:
| WO2015199219A1 | 2015-12-30 |
Foreign References:
| JP2011510046A | 2011-03-31 | |||
| JP2010254982A | 2010-11-11 | |||
| JP2018104678A | 2018-07-05 | |||
| JP2013241548A | 2013-12-05 | |||
| JP2007056196A | 2007-03-08 | |||
| JP2014201695A | 2014-10-27 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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