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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/049401
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin composition from which a cured film can be obtained which has high reliability and excellent bendability, has excellent processability of uneven patterns, and has sufficient light diffusivity. In order to achieve said purpose, a photosensitive resin composition according to the present invention includes (A) a siloxane resin, (B) particles having a median diameter of 0.2-0.6 μm, and (C) a naphthoquinone diazide compound, wherein (A) the siloxane resin contains at least 20-60 mol% of a repeating unit represented by general formula (1). (R1 represents a C6-C18 aryl group or a C6-C18 aryl group in which the entirety or a portion of hydrogen is substituted.)

Inventors:
KOBAYASHI HIDEYUKI (JP)
SUWA MITSUHITO (JP)
TOGO YUKINORI (JP)
Application Number:
PCT/JP2020/033372
Publication Date:
March 18, 2021
Filing Date:
September 03, 2020
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G02B5/02; G03F7/023; G03F7/075
Domestic Patent References:
WO2015012228A12015-01-29
Foreign References:
JP2007246877A2007-09-27
JP2014199919A2014-10-23
JP2017129663A2017-07-27
JP2007016214A2007-01-25
JP2014119643A2014-06-30
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