Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2022/163335
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin composition and compound having a low dielectric loss tangent when made into a cured film. The present invention is a photosensitive resin composition containing (A) a polyfunctional monomer, (B) a binder resin, and (C) a photopolymerization initiator, the (A) polyfunctional monomer containing a compound represented by formula (1) and/or a compound represented by formula (2), and the (B) binder resin containing one or more substances selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, polyamides, copolymers thereof, polyureas, polyesters, polysiloxanes, acrylic resins, phenol resins and benzocyclobutene resins, and maleic acid resins and cycloolefin polymers.
Inventors:
JUKEI MASAYA (JP)
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/000472
Publication Date:
August 04, 2022
Filing Date:
January 11, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08F2/50; C07C275/14; C08F265/00; C08F283/00; G03F7/004; G03F7/027; G03F7/032; G03F7/033; G03F7/037; G03F7/075; H01L21/312; H01L23/12
Domestic Patent References:
| WO2017030070A1 | 2017-02-23 | |||
| WO2017090559A1 | 2017-06-01 | |||
| WO2018066395A1 | 2018-04-12 |
Foreign References:
| JPH11293146A | 1999-10-26 | |||
| JPS53285A | 1978-01-05 | |||
| JP2000119335A | 2000-04-25 | |||
| JP2008501826A | 2008-01-24 |
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