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Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND DRY FILM PHOTORESIST, PHOTOSENSITIVE ELEMENT, CIRCUIT BOARD, AND DISPLAY DEVICE, EACH USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/137545
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin composition, and a dry film photoresist, a photosensitive element, a circuit board, and a display device, each using same, wherein the photosensitive resin uses an alkali developable binder resin comprising a repeating unit represented by chemical formula 1, a repeating unit represented by chemical formula 2, a repeating unit represented by chemical formula 3, and a repeating unit represented by chemical formula 4.

Inventors:
KIM YONG HYUN (KR)
BONG DONG HOON (KR)
Application Number:
PCT/KR2020/019181
Publication Date:
July 08, 2021
Filing Date:
December 28, 2020
Export Citation:
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Assignee:
KOLON INC (KR)
International Classes:
G03F7/004; C08F212/08; C08F220/06; C08F220/18; C08F220/28; C08F220/36; C08F265/06; G03F7/028; G03F7/033; G03F7/09
Foreign References:
JP2017167394A2017-09-21
JPH11316456A1999-11-16
JP2009042720A2009-02-26
KR20160131084A2016-11-15
KR20050106645A2005-11-11
CN101211111A2008-07-02
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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