PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2008/032674

Kind Code:

A1

Abstract:

Disclosed is a photosensitive resin composition containing a binder polymer (A), a photopolymerizable compound (B) having an ethylenically unsaturated bond and a photopolymerization initiator (C). This photosensitive resin composition is characterized in that the component (B) contains a photopolymerizable compound having an organic group represented by the following general formula (1). In the formula, R1 and R2 independently represent a hydrogen atom or a methyl group; L1 and L2 independently represent an alkylene group having 1-6 carbon atoms; and m and n independently represent an integer of 0-50 selected so that the total of m and n is 0-50.

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Inventors:

AJIOKA YOSHIKI (JP)
KOYANAGI KOUJI (JP)
WATANABE MITSUAKI (JP)

Application Number:

PCT/JP2007/067591

Publication Date:

March 20, 2008

Filing Date:

September 10, 2007

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
AJIOKA YOSHIKI (JP)
KOYANAGI KOUJI (JP)
WATANABE MITSUAKI (JP)

International Classes:

G03F7/027; C08F299/02; G03F7/004; H05K3/00; H05K3/06; H05K3/18

Domestic Patent References:

WO2001092958A1

2001-12-06

Foreign References:

JP2000010278A	2000-01-14
JPS63184744A	1988-07-30
JP2002162737A	2002-06-07
JP2000214583A	2000-08-04
JP3251446B2	2002-01-28
JP2005031639A	2005-02-03
JP3199600B2	2001-08-20

Other References: