PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2020/162464

Kind Code:

A1

Abstract:

The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.

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Inventors:

KURODA AYAKA (JP)
SUNOHARA SEIJI (JP)

Application Number:

PCT/JP2020/004182

Publication Date:

August 13, 2020

Filing Date:

February 04, 2020

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08F257/02; C08F2/44; C08F265/06; C08F290/06; G03F7/004; G03F7/033; H05K3/06; H05K3/18

Foreign References:

JP2018151489A	2018-09-27
JP2018204011A	2018-12-27
JP2001290265A	2001-10-19

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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