Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/029039
Kind Code:
A1
Abstract:
A photosensitive resin composition according to the present invention comprises a binder polymer having a structural unit derived from styrene or a styrene derivative, one or more photopolymerizable compounds, and a photopolymerization initiator, wherein the binder polymer has an acid value of 165-195 mgKOH/g and the photopolymerizable compounds include a (meth)acrylate having a phthalic acid skeleton.
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Inventors:
MUROMACHI MIYUKI (JP)
EBIHARA EMIKO (JP)
WATANABE MITSUAKI (JP)
EBIHARA EMIKO (JP)
WATANABE MITSUAKI (JP)
Application Number:
PCT/JP2019/031950
Publication Date:
February 18, 2021
Filing Date:
August 14, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08F12/00; C08F2/50; G03F7/004; G03F7/027; G03F7/033; H05K3/06; H05K3/18
Domestic Patent References:
WO2013125429A1 | 2013-08-29 | |||
WO2016017596A1 | 2016-02-04 | |||
WO2015156292A1 | 2015-10-15 |
Foreign References:
JP2013092675A | 2013-05-16 | |||
JP2017181663A | 2017-10-05 | |||
JP2018084591A | 2018-05-31 | |||
JP2014182305A | 2014-09-29 | |||
JP2006154556A | 2006-06-15 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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