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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT AND METHOD FOR PRODUCING LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2022/202485
Kind Code:
A1
Abstract:
A photosensitive resin composition which contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator and a hydrogen donor, wherein the photopolymerizable compound contains a compound having a ditrimethylolpropane skeleton. A photosensitive element 1 equipped with a support body 2 and a photosensitive resin layer 3 positioned on the support body 2, wherein the photosensitive resin layer 3 contains the aforementioned photosensitive resin composition.

Inventors:
WATANABE YUSAKU (JP)
OHTOMO SATOSHI (JP)
NARITA MAO (JP)
ONO KEISHI (JP)
TAKEDA AKIKO (JP)
Application Number:
PCT/JP2022/011565
Publication Date:
September 29, 2022
Filing Date:
March 15, 2022
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B05D3/06; B05D3/12; B05D7/24; B32B15/00; B32B27/16; B32B27/18; B32B27/30; G03F7/004; G03F7/027; G03F7/033; G03F7/40; H05K3/06
Domestic Patent References:
WO2018061707A12018-04-05
WO2021192058A12021-09-30
Foreign References:
JP2010061042A2010-03-18
JP2016071379A2016-05-09
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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