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Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/226052
Kind Code:
A1
Abstract:
A photosensitive resin composition which comprises a copolymer represented by general formula (1), a crosslinking agent, and a photosensitizer.

Inventors:
IKEDA HARUO (JP)
Application Number:
PCT/JP2020/017228
Publication Date:
November 12, 2020
Filing Date:
April 21, 2020
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08F290/12; G03F7/038; G03F7/20
Domestic Patent References:
WO2018131351A12018-07-19
Foreign References:
JP2018124502A2018-08-09
JP2014102503A2014-06-05
JPH10111569A1998-04-28
JP2014517087A2014-07-17
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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