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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM PRODUCED USING SAID COMPOSITION, AND ELECTRONIC COMPONENT PRODUCED USING SAID COMPOSITION OR SAID FILM
Document Type and Number:
WIPO Patent Application WO/2013/077358
Kind Code:
A1
Abstract:
A photosensitive resin composition comprising (A) a (meth)acrylate compound and (B) a photopolymerization initiator, wherein a (meth)acrylate compound having a urethane bond is contained as the component (A). The photosensitive resin composition enables the formation of a fine pattern even when the resin composition is formed into a film having a large thickness. A photosensitive resin layer formed from the resin composition has an excellent visible light transmissivity, and also has excellent heat resistance to such an extent that the resin layer undergoes less resin discoloration even when subjected to a long-term high-temperature thermal history.

Inventors:
KATOU SADAAKI (JP)
Application Number:
JP2012/080177
Publication Date:
May 30, 2013
Filing Date:
November 21, 2012
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/027; C08F290/06; C08F299/06; G03F7/004
Foreign References:
JP2005048144A2005-02-24
JP2010020108A2010-01-28
JP2011138037A2011-07-14
JP2011180571A2011-09-15
JPH09217004A1997-08-19
JPH08183823A1996-07-16
JP2011051340A2011-03-17
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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Claims: