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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN-CURED FILM, CURED FILM, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/029419
Kind Code:
A1
Abstract:
A photosensitive resin composition that includes: (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a photopolymerization initiator that includes the compound expressed in formula (11); (C) a thermal radical generator; and (D) a solvent including γ-butyrolactone. (In formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group including a substituted or unsubstituted carbazolyl group. R12 is a C1-12 alkyl group, a group including a C4-10 cycloalkyl group, a group including a phenyl group, or a group including a tolyl group. R13 is a substituted or unsubstituted C6-20 aromatic hydrocarbon group.)

Inventors:
TAHARA SHINGO (JP)
SAITO NOBUYUKI (JP)
MATSUKAWA DAISAKU (JP)
ENOMOTO TETSUYA (JP)
Application Number:
PCT/JP2020/030664
Publication Date:
February 18, 2021
Filing Date:
August 12, 2020
Export Citation:
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Assignee:
HD MICROSYSTEMS LTD (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/031; G03F7/40
Domestic Patent References:
WO2016194769A12016-12-08
WO2017043474A12017-03-16
WO2017104672A12017-06-22
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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