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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/171697
Kind Code:
A1
Abstract:
The present disclosure relates to a method for selecting a photosensitive resin composition, wherein: strip samples of a cured film having a film thickness of 10 μm and a width of 10 mm are produced by exposing resin films of photosensitive resin compositions to light at 100 to 2,000 mJ/cm2 and subjecting the resin films to a heat treatment for 1 to 3 hours at 150 to 250°C under nitrogen atmosphere; a fatigue test wherein the strip samples are repeatedly pulled under the conditions (1) where the set temperature is 25°C, the distance between chucks is 20 mm, the test speed is 5 mm/min, and the cyclic load stress is 100 MPa, or under the conditions (2) where the set temperature is -55°C, the distance between chucks is 20 mm, the test speed is 5 mm/min, and the cyclic load stress is 120 MPa is performed; and photosensitive resin compositions, the strip samples of which undergo 100 cycles of pulling or more before breaking in the fatigue test, are selected.

Inventors:
MITSUKURA KAZUYUKI (JP)
IMAZU YUKI (JP)
AOKI YU (JP)
KOMINE TAKUYA (JP)
Application Number:
PCT/JP2020/040109
Publication Date:
September 02, 2021
Filing Date:
October 26, 2020
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
G01N3/32; G03F7/023; G03F7/20; G03F7/26
Foreign References:
JP2018095721A2018-06-21
JP2018203959A2018-12-27
JP2010160419A2010-07-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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